TSMC has become the third largest patent applicant in the United States for the second year in a row.
Release time:
2022-08-10 11:02

TSMC, the well-knownAppleChip supply partner, since2019YearPositionThe third largest patent applicant in the United States. In addition to this, inIFI CLAIMSWebsite“2021years ago50U.S. Patent Applicants”On the leaderboard, TSMCRankingsSection4, while Samsung, HuaweiAnd apple is respectivelyRankingsSection2. fifthand No.Seven.
As2022Year5Month, TSMCofTotal global patent applicationsalreadyMore7.510,000 pieces, of which the total number of authorizations exceeds5.2Ten thousand pieces. TSMC continuous2The number of patent applications in the United States ranked third, while in Taiwan it was consecutive.6The number of patent applications in the year was the first.

In terms of patent quality, TSMC's2021Global patent licensing rate of up99%; of which the grant rate of U.S. patents reached100% before10Among the large patentees ranked No.1We will continue to strengthen our technological leadership and commercial competitive advantage.
TSMC says,CompanyInternal protection of R & D innovation and operational development with patents and business secrets. Establishment of TSMC Smart Property OfficeIt's"Patent Management System", through the deployment, application, maintenance, use and infringement countermeasures5Big strategy to master the patent map in all directions. In addition, TSMCVarious awards have been specially set up to encourage employees to innovate and improve the quality of their inventions.
On the other hand, TSMC in2021Year to full rangeof intellectual property rightsmanagement system applied for the Taiwan Ministry of Economic Affairs Bureau of Industry“Verification of intellectual property management system (TIPS)”, the first application is successfulAAAhighest grade, and2022He was awarded a certificate inTIPSThe first and only company to receive this award since its implementation.
United States, Patent, Ranking, Authorization, Patent Application, tips, Standing, All-round, Application